Thursday, 27 June 2019

HUBER+SUHNER to showcase latest innovations in connectivity and RF energy at electronica 2018

posted by HUBER+SUHNER
Monday 12 November 18

Alongside the recently launched CT assemblies, the company will demonstrate its future-proof solutions for automotive, energy and semi-conductor testing applications Herisau, 12 November – Leading manufacturer in electrical and optical connectivity solutions, HUBER+SUHNER is set to present a new era for critical connectivity at electronica 2018, Messe München, November 13–16. Designed for phase critical applications requiring ultimate precision and reliability, the company’s new product line of Consistent Over Temperature (CT) phase invariant cable assemblies provide industry leading performance across a number of key factors…

Alongside the recently launched CT assemblies, the company will demonstrate its future-proof solutions for automotive, energy and semi-conductor testing applications

Herisau, 12 November – Leading manufacturer in electrical and optical connectivity solutions, HUBER+SUHNER is set to present a new era for critical connectivity at electronica 2018, Messe München, November 13–16.

Designed for phase critical applications requiring ultimate precision and reliability, the company’s new product line of Consistent Over Temperature (CT) phase invariant cable assemblies provide industry leading performance across a number of key factors. With optimum stability over harsh temperatures, minimal phase and insertion loss, return loss and shielding effectiveness as well as simple and efficient installation, the CT assemblies are essential for applications where communication cannot be compromised, such as drones, military vehicles, and test and measurement scenarios. CT variants are available of the tried and tested Sucoform, EZ, Minibend, and Multiflex product families.

“We understand that connectivity comes first for our customers, especially those operating in military and defense, which is why our new CT range is available to suit a variety of applications depending on the customer's deployment specifications,” said Eduardo Romero, Product Manager Cable and Cable Assemblies for CT cable at HUBER+SUHNER. “These products provide the industry leading features, benefits and results that our customers expect and trust. The CT line is the perfect example of our holistic and inclusive approach to connectivity, and we are excited to present it to the attendees of electronica.”

Automotive connectivity solutions for the future
Featuring high-quality electrical performance, the company’s first automotive board-to-board connector – SynaPad – acts as a single, solderless piece which is easy to assemble and enables direct to board connection. The connector also has the ability to compensate axial and radial misalignments which are key for reducing mechanical stress during temperature changes and vibration.

With autonomous vehicles in mind, the company also offers injection moulded radar antennas to suit the latest radar systems being developed in the industry today. Utilising radiator geometries, three-dimensional signal distribution networks, radar systems using technology from HUBER+SUHNER provide higher resolution images, can measure large distances and detect obstacles even in harsh weather conditions.

RF energy for the future
Designed for the required high-power levels in peak demand applications, the RFEX connector – an industry-first connector dedicated to solid-state RF energy applications – is a key component for commercialising solid-state RF energy and thus achieving controllability in the respective applications. The highly cost-efficient solution provides customers with a reliable, long-term solution for overcoming today’s limitations in cooking, warming and heating.

A live demonstration of the RFEX will be at booth 439, where the HUBER+SUHNER team will be cooking and baking in an oven equipped with the HUBER+SUHNER RF energy solutions.

Semi-conductor testing essentials
Ultra-precise and highly-reproducible, the MXPM70 offers best-in-class signal integrity, magnetic locking mechanism, automatic interface protection and a cost-efficient PCD socket.

On display alongside the MXPM70, the full range of multi-coax connectors, including the MXPM and MXP lines will be showcased. Highly-flexible and ultra-stable as standard, the MXPM and MXP lines are essential for bench-top testing, system testing as well as for internal cabling in automated testing equipment.

Smart solution, smart charging
Supporting charging times below 15 minutes (up to an 80% state of charge), the RADOX® HPC High Power Charging system will also be on display. It guarantees quick, convenient and safe charging of electric vehicles. Offering a smaller cable cross section than others on the market today, the RADOX® HPC is available with Combined Charging System (CCS) type-1 (USA and Canada specific) and type-2 connectors (Europe compatible).

At Hall B2, Booth #439, attendees are encouraged to meet with the company’s engineers and product experts for specialist events on Tuesday, focusing on Semi-conductor testing, Wednesday for a Future Mobility event and Thursday for RF energy solutions.


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