Monday, 20 August 2018

HCL announces flexible 5G and mobile backhaul solution

posted by HCL
Friday 23 February 18

HCL Technologies (HCL), a leading global IT services company, announced today a fully configurable, high-throughput backhaul modem running on Xilinx All Programmable Zynq® UltraScale+™ MPSoC devices. The solution targets 5G access and mobile backhaul markets and will enable telecom OEMs to meet the stringent requirements of next-generation networks. Integrated backhaul and access are among the key technologies needed to enable ambitious 5G demands…

HCL Technologies (HCL), a leading global IT services company, announced today a fully configurable, high-throughput backhaul modem running on Xilinx All Programmable Zynq® UltraScale+™ MPSoC devices. The solution targets 5G access and mobile backhaul markets and will enable telecom OEMs to meet the stringent requirements of next-generation networks.

Integrated backhaul and access are among the key technologies needed to enable ambitious 5G demands. The increase in capacity of the 5G radio network needs to be supported by faster and wider bandwidth backhaul that incorporates Gigabit Ethernet, optical fiber, or microwave/mmWave wired and wireless point-to-point links. Xilinx is the leading silicon provider for wireless infrastructure for digital radio front end, connectivity, baseband acceleration, fronthaul/backhaul modem and packet processing functions. The programmability and scalability of Xilinx platforms make them an ideal fit for these applications, particularly for radio, where a variety of form factors, frequencies, bandwidths and radio access technologies need to be supported.

HCL’s solutions provide a range of benefits including enhanced radio performance, increased flexibility, and portability—along with other enhanced features. Together, the HCL and Xilinx integrated solution will provide a highly configurable backhaul modem on an advanced 16nm FinFET+ technology node (covering the spectrum of RF bands and E-bands, to V-bands) that will result in an overall reduction in bill-of-material (BOM) cost and a significant reduction in power dissipation compared to current solutions. Additionally, the plug and play architecture allows for custom IP to be embedded in the modem.

“The next generation of connected devices and machines will place tremendous bandwidth demands on the new 5G wireless networks,” said Farhad Shafai, Vice President of Communications Markets at Xilinx. “Telecommunications OEMs will need to leverage advanced silicon technology as well as application expertise to reduce both cost and time to market, and provide significant power efficiency. Together, HCL and Xilinx are delivering a powerful solution integrating both the modem and microcontroller, and drastically reducing the total bill-of material.”

“Telecommunications OEMs need enhanced capabilities for 5G, which is expected to power the growth of the mobile broadband, massive IoT, and mission-critical applications,” said Sukamal Banerjee, Corporate Vice President – ERS Sales (Hi Tech & Comm) and Head – IoT WoRKSTM, HCL Technologies. “HCL’s expertise in telecommunications provides us with a unique understanding into the dynamics of the 5G networks, for which next-generation mobile backhaul is a clear necessity. Working with Xilinx allowed us to bring our technology to a global audience of companies that will be on the forefront of this developing market.”

At Mobile World Congress
Debuting at MWC 2018, the joint Mobile Backhaul Solution will be demonstrated in the HCL booth in Barcelona on February 26- March 2, 2018. Visit HCL at booth 2H40 in Hall 2 for a live demonstration. To schedule a briefing, please email ers_info@hcl.com.


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